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Mobile Phone Chip Grinder LY-1002 Hot Sales
Jan 12, 2019

Mobile phone chip grinder LY-1002 Hot Sales

New upgraded LY 1002 auto BGA mobile IC router chipset repair CNC Milling Polishing Engraving Machine for iPhone Main Board chip maintance




Perfectly combined producs of BGA & CNC. CNC tech applied in BGA repair industry, make mobile repairing become more easier for CNC field users, can get more broad apply area


This item is perfect to grind and remove the CUP, HHD, WIFI, FONT chips in iPhone series mobile phone without any damage in the board. It is effective machine to help you repair the iPhone  6/6P/6S/6SP/7/7P/8/8P/X and ipad……. You can use the soldering station to solder a good chip in the board after grinding. Great grinding machine in mobile phone repairing and refurbishing.

1 year machine part and 6 months electrical partsstepping motorspindle Free Warranty


Technical Parameters

Machine Dimensions    580X560X750mm

Mould size:       150X135 mm

Engraving area     200X100X100 mm

Rail type        Linear guide

Type of screw        Ball screw 1605, Pitch 4mm

Spindle motor        800W water cooling spindle , 0-24000r/min

Collet type    ER11,1/8"(3.175mm) Collet

Repeat positioning Accuracy        0.01mm

Communication interface     Not need computer/ SD Card / HD camera.

Software Compatability        Firmware v1.o

Machine weight   78kg

Package size    600*600*800mm


The machine already assembled & tested well, can directly use after take them out from package

Product advantage:

a. Easy for learn and use          

b. Intelligent system

c. Automatic detection            

d. Visual design

e. high precision                 

f. SD card storage


Packing list:

Mould x 9 pcs for IP( 6/6P/6S/6SP/7/7P/8/8P/X, Size:150*135mm) with relative files

Power cord x 1

Ground wire x 1

Drill tips x 1 box(50pcs)

Allen wrench x 1

Spindle wrech x 2

Dust blower x 1

LY 1002 (10)

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